以600mm×600mm面板为例，其面积是12英寸晶圆载板的5.1倍，单片产出芯片数量大幅增加。同时，FOPLP的面积利用率超95%，显著优于传统晶圆级封装的85%，同等面积下面板可多容纳1.64倍芯片。基板面积增大持续降低成本，200mm向300mm过渡节约25%成本，300mm向板级封装过渡更可节约66%成本。
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His move to the startup world was inspired by Clayton Christensen’s The Innovator’s Dilemma, which argues that market leaders, by nature, are often set up to fail. “This thesis made me really understand how the technology industry was going to be much bigger, much faster than most thought in the late ’90s,” he told Authority Magazine in 2021. “This made me take the risk of working at my first startup because I believed that big companies were at risk of being disrupted due to the advent of the internet and mobile phones.”